一、铝基板的特点
A characteristic, aluminum substrate
●采用表面贴装技术(SMT);
Adopt the surface mount technology (SMT);
●在电路设计方案中对热扩散进行极为有效的处理;
In circuit design of thermal diffusion in a very effective treatment;
●降低产品运行温度,提高产品功率密度和可靠性,延长产品使用寿命;
- reduce the operating temperature of